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Thermal Risk Management

Check your Printed Circuit Boards for “Thermal Integrity” with TRM

TRM (“Thermal Risk Management”) is a computational simulation software by Adam Research. It traces temperatures due to Joule heating (current carrying capacity) and board heating by components are calculated from physical principles but without academic ballast.

Licensing of TRM

The software is delivered either with a dongle license (USB stick) or a FlexNet license (on license server).

Key Features

  • 3D board model 3D board model
  • Independent of electronic CAD systems Independent of electronic CAD systems
  • High resolution virtual thermograph result High resolution virtual thermograph result
  • DC Voltage drop and distribution DC Voltage drop and distribution
  • Electric (Joule) heating in traces Electric (Joule) heating in traces
  • All traces and components All traces and components
  • Coupling to various environment conditions Coupling to various environment conditions
  • Steady state and transient Steady state and transient
  • Temperature feed-back on electric properties Temperature feed-back on electric properties
  • Interfaced with Altium Designer Interfaced with Altium Designer
  • Drawing board Drawing board
  • Affordable Affordable
Thermal Management with trm is: All Details

Fields of applications: LED Boards - Automotive – Power electronics – Electric mobility - Mechatronics - Avionics - Backplanes – Converters – Aerospace

The calculated thermographs comes in high-resolution with visualized hotspots and identified regions of thermo-mechanical stress, caused by high temperature gradients.

Benefits

The calculated thermographs comes in high-resolution with visualized hotspots and identified regions of thermo-mechanical stress, caused by high temperature gradients. The calculated current density picture shows where the electric bottleneck creates hotspot and where constrictions have no concern. This cannot be achieved by any automated design rule check. By changing layer thickness, number of layers or environment conditions can explore the thermal limits of the board. Proper combination of actions can result in savings the raw material, machine drilling time or a better soldering result.

Boards

TRM can handle boards with

  • Single Layers Single Layers
  • Multilayers Multilayers
  • SMD Components SMD Components
  • Embedded Components Embedded Components
  • Heat Sinks Heat Sinks
  • Cables Cables
  • Pins Pins
  • Inlays Inlays
  • Bus Bars Bus Bars
  • Specisl Copper Thickness Specisl Copper Thickness
  • Chassis Parts and Bolts Chassis Parts and Bolts
  • Adhesives Adhesives
  • Selection of Materials Selection of Materials
  • Plugged and Unplugged Plugged and Unplugged
  • Blind and Buried Vias Blind and Buried Vias
  • Insulated Metal Substrate Insulated Metal Substrate

Steps that are needed to achieve temperature compliance

The TRM software can simulate all types of multilayers, SMD components, embedded passives, pins, Inlays, bus bars, adhesives, plugged and unplugged, blind and buried vias, as long as the PCB is more or less flat. Compare technologies yourself and test what is coolest and what is an economically reasonable compromise.

  • Check the drilling Time Check the drilling Time
  • Number of layers Number of layers
  • Cost of material Cost of material
  • Foot print area Foot print area