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Problem Statement

With the explosive growth of connected devices and bandwidth-intensive applications, enterprises are demanding next-gen wireless infrastructure capable of delivering faster speeds, lower latency, and enhanced spectrum efficiency. Wi-Fi 7, with its support for wider channels, 4K QAM, and multi-link operation, is poised to redefine wireless performance across enterprise and consumer environments.

To capitalize on this shift, OEMs are racing to introduce compact, high-performance, and cost-effective Wi-Fi 7 access points that can serve dense user environments without compromising reliability or efficiency.

Customer Requirements

A leading US-based OEM in the enterprise networking space engaged VVDN to develop a low-cost, tri-band Wi-Fi 7 access point tailored for campus and enterprise deployments. Their goal was to launch a future-ready product that balances performance, form factor and cost.

Key customer requirements included:
  • Compact form factor with thermal and RF efficiency
  • 2x2x2 Tri-band MIMO support (2.4GHz, 5GHz, 6GHz)
  • Cost-optimized hardware architecture aligned with Wi-Fi 7 specifications
  • Integration readiness with their proprietary Wi-Fi software stack
  • Fast-track development and mass production readiness
  • Fully AFC enabled operation with GPS integration
  • Alignment with Make in India for high local content and Class 1 compliance

Key Challenges Faced by VVDN

  • Thermal & RF Coexistence : Balancing heat dissipation and RF performance within a compact enclosure across all three bands.
  • Component Selection & Cost Optimization : Balancing cost efficiency while meeting Wi-Fi 7 throughput and latency goals.
  • Mechanical Miniaturization : Delivering a robust and thermally optimized mechanical design within a small form factor.
  • Antenna Integration :Integrating and tuning six antennas within a single housing for best-in-class coverage and throughput.
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