Thermal Risk Management

Check your Printed Circuit Boards for “Thermal Integrity” with TRM

TRM (“Thermal Risk Management”) is a computational simulation software by Adam Research. It traces temperatures due to Joule heating (current carrying capacity) and board heating by components are calculated from physical principles but without academic ballast.

Licensing of TRM

The software is delivered either with a dongle license (USB stick) or a FlexNet license (on license server).

Key Features

  • 3D board model
  • Independent of electronic CAD systems
  • High resolution virtual thermograph result
  • DC Voltage drop and distribution
  • Electric (Joule) heating in traces
  • All traces and components
  • Coupling to various environment conditions
  • Steady state and transient
  • Temperature feed-back on electric properties
  • Interfaced with Altium Designer
  • Drawing board
  • Affordable

Fields of applications: LED Boards - Automotive – Power electronics – Electric mobility - Mechatronics - Avionics - Backplanes – Converters – Aerospace

Benefits

The calculated thermographs comes in high-resolution with visualized hotspots and identified regions of thermo-mechanical stress, caused by high temperature gradients. The calculated current density picture shows where the electric bottleneck creates hotspot and where constrictions have no concern. This cannot be achieved by any automated design rule check. By changing layer thickness, number of layers or environment conditions can explore the thermal limits of the board. Proper combination of actions can result in savings the raw material, machine drilling time or a better soldering result.

Boards

TRM can handle boards with

  • Single Layers
  • Multilayers
  • SMD Components
  • Embedded Components
  • Heat Sinks
  • Cables
  • Pins
  • Inlays
  • Bus Bars
  • Specisl Copper Thickness
  • Chassis Parts and Bolts
  • Adhesives
  • Selection of Materials
  • Plugged and Unplugged
  • Blind and Buried Vias
  • Insulated Metal Substrate

Steps that are needed to achieve temperature compliance

The TRM software can simulate all types of multilayers, SMD components, embedded passives, pins, Inlays, bus bars, adhesives, plugged and unplugged, blind and buried vias, as long as the PCB is more or less flat. Compare technologies yourself and test what is coolest and what is an economically reasonable compromise.

  • Check the drilling Time
  • Number of layers
  • Cost of material
  • Foot print area